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Test and Measurement

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Custom Software Engineering
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Test and Measurement Automation

Silicon Wafer
Silicon Wafer
Measurement Screen
Measurement Screen

Silicon Wafer Processing

Summary

DMC consulted on a large-scale project for a semi-conductor manufacturer to overhaul the architecture and provide technical direction for a new line of micro-motion manufacturing systems.

Customer Benefits

  • Improves process accuracy to within a 5 micron tolerance
  • Reduces production time with increased speed
  • Top level project consulting and coordination allowed large-scale project to meet deadlines

Technologies

  • 8 axis MEI DSP motion card
  • Allen Bradley DeviceNet I/O
  • NEAT linear servo motors, amplifiers
  • DVT Vision Inspection Cameras
  • Citect HMI
  • Custom Microsoft Visual Basic
  • 6.0® Active X Components
  • Microsoft Access® ODBC database

Solution

The system is controlled by Steeplechase, an 8-axis MEI DSP motion control card and Allen Bradley Devicenet I/O. Citect and Visual Basic applications supplement the HMI. An X/Y linear stage along with an angular axis is used to position silicon wafers for processing. A DVT camera is used to obtain wafer position information allowing compensation for the slight variations in placement for the tooling, which is crucial for high-accuracy processing.